Invention Grant
- Patent Title: Method for installing a switch pad
- Patent Title (中): 安装开关板的方法
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Application No.: US11253515Application Date: 2005-10-19
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Publication No.: US07657994B2Publication Date: 2010-02-09
- Inventor: Chris R. Snider , Mark A. Gill
- Applicant: Chris R. Snider , Mark A. Gill
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Jimmy L. Funke
- Main IPC: H01H11/00
- IPC: H01H11/00 ; H01H13/52
Abstract:
Methods and apparatuses are disclosed for assembling a first component, such as a switch pad, to a second component, such as a circuit board.
Public/Granted literature
- US20070084044A1 Method and apparatus for installing a switch pad Public/Granted day:2007-04-19
Information query
