Invention Grant
US07657998B2 Method of making a resin-packaged protection circuit module for rechargeable batteries
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制造可充电电池的树脂封装保护电路模块的方法
- Patent Title: Method of making a resin-packaged protection circuit module for rechargeable batteries
- Patent Title (中): 制造可充电电池的树脂封装保护电路模块的方法
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Application No.: US11523663Application Date: 2006-09-20
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Publication No.: US07657998B2Publication Date: 2010-02-09
- Inventor: Naoya Tanaka
- Applicant: Naoya Tanaka
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Paul, Hastings, Janofsky & Walker LLP
- Priority: JP2001-372504 20011206
- Main IPC: H05K3/34
- IPC: H05K3/34
Abstract:
A protection circuit module for rechargeable batteries includes a substrate, electronic components mounted on the obverse surface of the substrate for forming a protection circuit for rechargeable batteries, a housing mounted on the obverse surface of the substrate and including a top wall partially defining an enclosure for accommodating the electronic components, and a resin sealer loaded in the enclosure of the housing for sealing the electronic components. The top wall of the housing includes an opening for loading the resin sealer into the housing.
Public/Granted literature
- US20070014092A1 Resin-packaged protection circuit module for rechargeable batteries and method of making the same Public/Granted day:2007-01-18
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