Invention Grant
- Patent Title: Boiling and cooling device
- Patent Title (中): 沸腾冷却装置
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Application No.: US11300110Application Date: 2005-12-14
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Publication No.: US07658223B2Publication Date: 2010-02-09
- Inventor: Yoshiyuki Okamoto , Hiroshi Tanaka , Sho Ishii
- Applicant: Yoshiyuki Okamoto , Hiroshi Tanaka , Sho Ishii
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2004-371247 20041222
- Main IPC: F28D15/00
- IPC: F28D15/00

Abstract:
A refrigerant tank includes a base plate made of cooper and a reinforcing frame made of stainless steel. A block made of copper extends through the reinforcing frame and has one face in contact with the base plate and an opposite face in contact with a heating body. Heat generated by the heating body is transferred through the cooper block and through the copper base plate to refrigerant inside the refrigerant tank. The stainless steel reinforcing frame provides strength to the refrigerant tank to allow the heating body to be pressed against the heating tank.
Public/Granted literature
- US20060131001A1 Boiling and cooling device Public/Granted day:2006-06-22
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