Invention Grant
- Patent Title: Methods and apparatus for forming hole in ground
- Patent Title (中): 在地面上形成孔的方法和装置
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Application No.: US12045945Application Date: 2008-03-11
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Publication No.: US07658240B2Publication Date: 2010-02-09
- Inventor: Paul L. Anderson
- Applicant: Paul L. Anderson
- Agency: Kamrath & Associates PA
- Agent Alan Kamrath
- Main IPC: E21B7/26
- IPC: E21B7/26

Abstract:
An apparatus for forming a hole in ground (10) includes a mounting plate (60) mounted to a loader (80). A probe (11) is coupled with the mounting plate (60). Two arms (32) extend radially outward from a vertical axis and from a periphery of the probe (11). The apparatus further includes two cylinders (40) each having an upper end (42) coupled to the mounting plate (60) and a lower end (44) coupled to one of the arms (32). The probe (11) is driven into the ground along the vertical axis by movement of the mounting plate (60) by the loader (80), and an upper portion of the probe (11) is simultaneously wobbled about two axes that are perpendicular to each other and to the vertical axis by moving at least one of the cylinders (40). The probe (11) is then moved out of the ground to leave a hole in the ground.
Public/Granted literature
- US20080223615A1 Methods and Apparatus for Forming Hole in Ground Public/Granted day:2008-09-18
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