Invention Grant
- Patent Title: Blister and package system
- Patent Title (中): 吸塑和包装系统
-
Application No.: US10596946Application Date: 2005-01-07
-
Publication No.: US07658287B2Publication Date: 2010-02-09
- Inventor: Christopher J. Hession
- Applicant: Christopher J. Hession
- Applicant Address: US VA Richmond
- Assignee: MeadWestvaco Corporation
- Current Assignee: MeadWestvaco Corporation
- Current Assignee Address: US VA Richmond
- Agent Alison R. Scheidler; Tsugihiko Suzuki
- International Application: PCT/US2005/000644 WO 20050107
- International Announcement: WO2005/068304 WO 20050728
- Main IPC: B65D85/00
- IPC: B65D85/00

Abstract:
A blister and package system (1) made of a blister card (3) and an outer package (5) with unique interacting locking mechanisms (23). The blister card is inserted in the outer package and locks immediately without having to further process the outer package or the blister card. The user is able to expose the blisters from the outer package by disengaging the lock. The blister card includes a formable, pliable sheet material (7), into which one or more individual cavities or blisters (9) are formed. The separated cavities are loaded with product (11) and sealed with one or more layers of puncturable or tearable sheet material, such as aluminum foil (13). The blister card contains a stop (21), which may be one or more additional cavities that form an interference mechanism, or an interference blister cavity. The interference blister is trapped by a locking mechanism and stopped by a catch flap (41) included in the outer package.
Public/Granted literature
- US20070272586A1 Blister and Package System Public/Granted day:2007-11-29
Information query
IPC分类: