Invention Grant
- Patent Title: Tail wire cutting method and bonding apparatus
- Patent Title (中): 尾丝切割方法和粘合装置
-
Application No.: US11788966Application Date: 2007-04-23
-
Publication No.: US07658314B2Publication Date: 2010-02-09
- Inventor: Shinsuke Tei , Noriko Mori
- Applicant: Shinsuke Tei , Noriko Mori
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee Address: JP Tokyo
- Agent William L. Androlia; H. Henry Koda
- Priority: JP2006-119222 20060424
- Main IPC: B23K31/00
- IPC: B23K31/00

Abstract:
A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circular arc that has an apex at the above-described predetermined height, thus forming (minute) cracks in a portion between the tail wire and a bonding end of a bonding point, and then cutting of a tail wire sticking out of the tip end of the capillary is executed by way of raising the capillary and clamper.
Public/Granted literature
- US20070246513A1 Tail wire cutting method and bonding apparatus Public/Granted day:2007-10-25
Information query
IPC分类: