Invention Grant
- Patent Title: Locating structure for an instrument panel assembly of a motor vehicle
- Patent Title (中): 机动车辆仪表板组件的定位结构
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Application No.: US11971644Application Date: 2008-01-09
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Publication No.: US07658433B2Publication Date: 2010-02-09
- Inventor: Vikram Chopra , Chae Han An , Benjamin Warren Penner
- Applicant: Vikram Chopra , Chae Han An , Benjamin Warren Penner
- Applicant Address: US KY Erlanger
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US KY Erlanger
- Agency: Gifford, Krass, Sprinkle, Anderson & Citkowski, P.C.
- Main IPC: B62D25/14
- IPC: B62D25/14

Abstract:
An instrument panel assembly for a motor vehicle includes a first component, a second component and a frame. The first component has a first aperture. The second component has a second aperture. The frame has a main wall. The frame includes a generally cylindrical boss extending outwardly from the main wall. The boss has an outer surface. The boss has a bore aligned with the first aperture of the first component to receive a fastener therethrough to secure the first component to the frame. The boss extends through the second aperture of the second component such that the outer surface locates the second component relative to the frame along a plane generally orthogonal to a longitudinal axis of the boss. The second component is disposed between the first component and the frame so as to be constrained along the longitudinal axis of the boss.
Public/Granted literature
- US20090174221A1 Locating Structure For An Instrument Panel Assembly Of A Motor Vehicle Public/Granted day:2009-07-09
Information query
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