Invention Grant
- Patent Title: Printhead assembly laminated ink distribution stack
- Patent Title (中): 打印头组装层压油墨分配堆叠
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Application No.: US12050949Application Date: 2008-03-19
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Publication No.: US07658467B2Publication Date: 2010-02-09
- Inventor: Kia Silverbrook
- Applicant: Kia Silverbrook
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: B41J2/155
- IPC: B41J2/155 ; B41J2/05

Abstract:
The invention provides for an elongate printhead assembly for a pagewidth printer. The printhead assembly includes a printed circuit board (PCB) having mounted thereon various electronic components to facilitate operation of the printer. A number of printhead integrated circuits are respectively angularly disposed with respect to a longitudinal axis of the PCB. Tape automated bond (TAB) film is in register with a number of printhead integrated circuits. The film is configured to arrange the integrated circuits in signal communication with the electronic components. The assembly also includes an ink distribution molding for distributing ink from an ink reservoir to the integrated circuits, and a laminated stack arranged between the ink distribution molding and the integrated circuits for ducting the ink to respective integrated circuits.
Public/Granted literature
- US20080158296A1 PRINTHEAD ASSEMBLY LAMINATED INK DISTRIBUTION STACK Public/Granted day:2008-07-03
Information query
IPC分类: