A method of using a flexible circuit, including attaching a first portion of the flexible circuit, via an attaching surface of the flexible circuit, to a first surface of a chip carrier. Statically bending a bending portion of the flexible circuit around an edge formed at the intersection of the first surface of the chip carrier, and a second surface of the chip carrier. Adhesively attaching a second portion of the flexible circuit, via the attaching surface, to the second surface of the chip carrier, where the second portion of the flexible circuit has at least one first anchor structure formed in the attaching surface, where the at least one first anchor structure is adapted to accept an adhesive.