Invention Grant
- Patent Title: Method for evaluating solder joint portion
- Patent Title (中): 焊接部分评估方法
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Application No.: US12056745Application Date: 2008-03-27
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Publication No.: US07658538B2Publication Date: 2010-02-09
- Inventor: Hirofumi Koike , Akikazu Matsumoto , Wataru Yagi , Takefumi Isogai , Yoshiharu Hirose , Hiroaki Kadoura , Juntaro Seki , Hisaaki Takao
- Applicant: Hirofumi Koike , Akikazu Matsumoto , Wataru Yagi , Takefumi Isogai , Yoshiharu Hirose , Hiroaki Kadoura , Juntaro Seki , Hisaaki Takao
- Applicant Address: JP Kariya-shi
- Assignee: Aisin Seiki Kabushiki Kaisha
- Current Assignee: Aisin Seiki Kabushiki Kaisha
- Current Assignee Address: JP Kariya-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-093762 20070330
- Main IPC: G01N25/72
- IPC: G01N25/72
Abstract:
A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.
Public/Granted literature
- US20080240201A1 METHOD FOR EVALUATING SOLDER JOINT PORTION Public/Granted day:2008-10-02
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