A specific-light-cured and pressure-differential embossing apparatus for embossing a specific-light-cured layer on a substrate includes a housing assembly, a mold, an elastic driving module, a pressure-difference generating module, and a specific light providing module. The substrate and the mold are disposed in a chamber of the housing assembly. The mold faces the specific-light-cured layer on the substrate. The elastic driving module is disposed in the chamber to divide the chamber into a first sub-chamber and a second sub-chamber. The pressure-difference generating module, connected to the first sub-chamber and the second sub-chamber, generates a pressure difference between the first sub-chamber and the second sub-chamber, and drives the elastic driving module to move and thus to drive the mold to move and press the specific-light-cured layer. The specific light providing module provides specific light to the specific-light-cured layer to cure the specific-light-cured layer.