An enhanced contact construction and loading support mechanism for plastic land grid array (PLGA) modules. A plurality of inverted hybrid land grid array (LGA) contacts are each respectively captured in and extend at least partially through one of a plurality of holes of an inverted hybrid LGA interposer. The inverted hybrid LGA contacts are affixed to a plurality of metal pads on a PLGA module carrier. Preferably, the inverted hybrid LGA contacts are affixed simultaneously using surface-mount technology (SMT) and have a metallurgy construction (e.g., beryllium-copper springs coated with nickel and hard gold) that provides enhanced wear and corrosion resistance. Each of the inverted hybrid LGA contacts is configured to make mechanical/pressure contact with a metal contact on another substrate, such as a printed wiring board (PWB). The inverted hybrid LGA interposer supports the PLGA module carrier and, in addition, a stiffener frame (with or without a heat sink) may be provided to reinforce the PLGA module carrier.