Invention Grant
- Patent Title: Electrical connector having an improved frame
- Patent Title (中): 电连接器具有改进的框架
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Application No.: US12156863Application Date: 2008-06-04
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Publication No.: US07658620B2Publication Date: 2010-02-09
- Inventor: Shih-Wei Hsiao , Hsiu-Yuan Hsu
- Applicant: Shih-Wei Hsiao , Hsiu-Yuan Hsu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: TW96209150 20070604
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector adapted for connection an Integrated Circuit (IC) chip to a printed circuit board (PCB) includes an insulating housing having a plurality of passageways, a plurality of contacts received in the passageways and a frame moveable assembled on the housing to allow the IC chip to be inserted therein. The frame includes a first and second side walls parallel to each other and a third side wall connecting with ends of the first and second side walls without a sidewall opposite the third wall, thereby a hatch is defined opposite to the third wall.
Public/Granted literature
- US20080299797A1 Electrical connector having an improved frame Public/Granted day:2008-12-04
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