Invention Grant
- Patent Title: System and method for connecting electronic components
- Patent Title (中): 用于连接电子元件的系统和方法
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Application No.: US11108338Application Date: 2005-04-18
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Publication No.: US07658630B2Publication Date: 2010-02-09
- Inventor: Roger E. Tipley , Arthur G. Volkmann , Barry S. Basile , Steve L. Radabaugh
- Applicant: Roger E. Tipley , Arthur G. Volkmann , Barry S. Basile , Steve L. Radabaugh
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01R13/15
- IPC: H01R13/15 ; H01R13/62

Abstract:
A system and method for connecting electrical components. More specifically, a method includes positioning a first set of electrical contacts of a first device opposite from a second set of electrical contacts of a second device, and activating a mechanism configured to rotate the first set of electrical contacts between an engaged position against the second set of electrical contacts and a disengaged position offset from the second set of electrical contacts.
Public/Granted literature
- US20060234540A1 System and method for connecting electronic components Public/Granted day:2006-10-19
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