Invention Grant
- Patent Title: Jack assembly arrangement with staggered jack bores
- Patent Title (中): 杰克组装布置与交错千斤顶孔
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Application No.: US12290910Application Date: 2008-11-05
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Publication No.: US07658650B2Publication Date: 2010-02-09
- Inventor: Roy Lee Henneberger , James D. Dewey , Ahmad R. Sajadi
- Applicant: Roy Lee Henneberger , James D. Dewey , Ahmad R. Sajadi
- Applicant Address: US MN Eden Prairie
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Merchant & Gould P.C.
- Main IPC: H01R24/04
- IPC: H01R24/04

Abstract:
The present disclosure relates to a jack assembly including a jack mount having a front side and a rear side. A jack of the assembly is adapted to be slidably mounted in a jack receiving region of the jack mount. The jack assembly also includes a plurality of cross-connect contacts, and a rear interface assembly. The rear interface assembly includes a dielectric cover piece and a plurality of rear connectors that project outward from the dielectric cover piece.
Public/Granted literature
- US20090075522A1 Jack assembly Public/Granted day:2009-03-19
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