Invention Grant
- Patent Title: Spring biased blade contact
- Patent Title (中): 弹簧偏置刀片接触
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Application No.: US12069232Application Date: 2008-02-07
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Publication No.: US07658656B2Publication Date: 2010-02-09
- Inventor: Hsiu-Yuan Hsu , Hung-Yang Yeh
- Applicant: Hsiu-Yuan Hsu , Hung-Yang Yeh
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: CN200720034629U 20070208
- Main IPC: H01R13/24
- IPC: H01R13/24
Abstract:
A contact includes a first contact pin (21) of a blade shape, a second contact pin (22) and a spring (23). The second contact pin includes a connecting portion (223) and a receiving portion (222) opposite to the connecting portion. The receiving portion defines a receiving space (224) to accommodate the first contact pin. The spring locates in the receiving space and allow the first contact pin to shift downwards and upwards therein.
Public/Granted literature
- US20080194123A1 Blade contact for electronic device Public/Granted day:2008-08-14
Information query
