Invention Grant
US07658798B2 Method for fixing metal particles and method for manufacturing substrate containing metal particles, method for manufacturing substrate containing carbon nanotube, and method for manufacturing substrate containing semiconductor-crystalline rod, employing thereof
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用于固定金属颗粒的方法和用于制造含有金属颗粒的基材的方法，用于制造含有碳纳米管的基材的方法，以及用于制造含有半导体结晶棒的基材的方法
- Patent Title: Method for fixing metal particles and method for manufacturing substrate containing metal particles, method for manufacturing substrate containing carbon nanotube, and method for manufacturing substrate containing semiconductor-crystalline rod, employing thereof
- Patent Title (中): 用于固定金属颗粒的方法和用于制造含有金属颗粒的基材的方法，用于制造含有碳纳米管的基材的方法，以及用于制造含有半导体结晶棒的基材的方法
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Application No.: US10564750Application Date: 2004-07-20
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Publication No.: US07658798B2Publication Date: 2010-02-09
- Inventor: Masahiko Ishida , Hiroo Hongo , Jun-ichi Fujita
- Applicant: Masahiko Ishida , Hiroo Hongo , Jun-ichi Fujita
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-276482 20030718
- International Application: PCT/JP2004/010301 WO 20040720
- International Announcement: WO2005/007564 WO 20050127
- Main IPC: C30B25/12
- IPC: C30B25/12
Abstract:
A metal fine particle is adhere to a predetermined location on a substrate. A resist film containing a metallic compound dispersed therein is formed on a substrate (101). A patterning of the resist film is conducted by a lithography. The substrate (101) having the patterned resist formed thereon is heated within an oxygen atmosphere to adhere a metal fine particle (106) to the surface of the substrate (101), while removing the resin in the patterned resist.
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