Invention Grant
- Patent Title: Heat treatment apparatus
- Patent Title (中): 热处理设备
-
Application No.: US10561017Application Date: 2004-06-22
-
Publication No.: US07658801B2Publication Date: 2010-02-09
- Inventor: Junichi Arami
- Applicant: Junichi Arami
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-178690 20030623
- International Application: PCT/JP2004/008747 WO 20040622
- International Announcement: WO2004/114377 WO 20041229
- Main IPC: H01L21/00
- IPC: H01L21/00 ; C23C14/00 ; C23C16/00
Abstract:
A heating means is disclosed which comprises a reflector plate composed of an opaque quartz and a quartz tube welded to the surface of the reflector plate. A carbon wire which generates heat when a current is applied is inserted in the quartz tube.
Public/Granted literature
- US20070095289A1 Heat treatment apparatus Public/Granted day:2007-05-03
Information query
IPC分类:
