Invention Grant
- Patent Title: Three dimensional microstructures and methods for making three dimensional microstructures
- Patent Title (中): 制作三维微结构的三维微结构和方法
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Application No.: US11306291Application Date: 2005-12-21
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Publication No.: US07658831B2Publication Date: 2010-02-09
- Inventor: Gaetan L. Mathieu , Treliant Fang , Eric D. Hobbs
- Applicant: Gaetan L. Mathieu , Treliant Fang , Eric D. Hobbs
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc
- Current Assignee: FormFactor, Inc
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: C25D5/02
- IPC: C25D5/02
Abstract:
Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
Public/Granted literature
- US20070141743A1 THREE DIMENSIONAL MICROSTRUCTURES AND METHODS FOR MAKING THREE DIMENSIONAL MICROSTRUCTURES Public/Granted day:2007-06-21
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