Invention Grant
- Patent Title: Metal pattern and process for producing the same
- Patent Title (中): 金属图案及其制造方法
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Application No.: US10568158Application Date: 2005-01-13
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Publication No.: US07658860B2Publication Date: 2010-02-09
- Inventor: Tohru Nakagawa
- Applicant: Tohru Nakagawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2004-008508 20040115
- International Application: PCT/JP2005/000267 WO 20050113
- International Announcement: WO2005/069705 WO 20050728
- Main IPC: C03C15/00
- IPC: C03C15/00 ; C03C25/68 ; C25F3/00

Abstract:
A metal pattern of the present invention is a metal pattern (13′) formed on a surface of a substrate by etching, and a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n—, where n represents an integer) is formed on a surface of a metal film composing the metal pattern (13′), and a masking film (18) is formed by penetration of a molecule having a mercapto group (—SH) or a disulfide (—SS—) group into interstices between molecules composing the monomolecular film. The metal pattern is produced by: forming a monomolecular film containing fluorinated alkyl chains (CF3(CF2)n—, where n represents an integer) on a surface of a metal film; forming a masking film by applying a solution in which a molecule having a mercapto group (—SH) or a disulfide (—SS—) group is dissolved over a surface of the monomolecular film so that the molecule having a mercapto group (—SH) or a disulfide (—SS—) group penetrates in interstices between molecules composing the monomolecular film; and etching the metal film by exposing the surface of the metal film to an etching solution so that a portion of the metal film in a region not covered with the masking film is removed.
Public/Granted literature
- US20090139421A1 Metal pattern and process for producing the same Public/Granted day:2009-06-04
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