Invention Grant
- Patent Title: Printed circuits prepared from filled epoxy compositions
- Patent Title (中): 由填充的环氧组合物制备的印刷电路
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Application No.: US11732344Application Date: 2007-04-03
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Publication No.: US07658988B2Publication Date: 2010-02-09
- Inventor: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
- Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Agent Gail D. Tanzer
- Main IPC: B32B9/00
- IPC: B32B9/00
Abstract:
Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.
Public/Granted literature
- US20070231469A1 Printed circuits prepared from filled epoxy compositions Public/Granted day:2007-10-04
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