Invention Grant
- Patent Title: Full phase shifting mask in damascene process
- Patent Title (中): 镶嵌过程中的全相移掩模
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Application No.: US12184215Application Date: 2008-07-31
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Publication No.: US07659042B2Publication Date: 2010-02-09
- Inventor: Christophe Pierrat
- Applicant: Christophe Pierrat
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Bever, Hoffman & Harms, LLP
- Agent Jeanette S. Harms
- Main IPC: G03F1/02
- IPC: G03F1/02

Abstract:
A full phase shifting mask (FPSM) can be advantageously used in a damascene process for hard-to-etch metal layers. Because the FPSM can be used with a positive photoresist, features on an original layout can be replaced with shifters on a FPSM layout. Adjacent shifters should be of opposite phase, e.g. 0 and 180 degrees. In one embodiment, a dark field trim mask can be used with the FPSM. The trim mask can include cuts that correspond to cuts on the FPSM. Cuts on the FPSM can be made to resolve phase conflicts between proximate shifters. In one case, exposing two proximate shifters on the FPSM and a corresponding cut on the trim mask can form a feature in the metal layer. The FPSM and/or the trim mask can include proximity corrections to further improve printing resolution.
Public/Granted literature
- US20080286664A1 Full Phase Shifting Mask In Damascene Process Public/Granted day:2008-11-20
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