Invention Grant
US07659047B2 Materials for photoresist, negative-tone photoresist composition, method of forming resist pattern, and semiconductor device
有权
用于光致抗蚀剂,负色光致抗蚀剂组合物的材料,形成抗蚀剂图案的方法和半导体器件
- Patent Title: Materials for photoresist, negative-tone photoresist composition, method of forming resist pattern, and semiconductor device
- Patent Title (中): 用于光致抗蚀剂,负色光致抗蚀剂组合物的材料,形成抗蚀剂图案的方法和半导体器件
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Application No.: US11607031Application Date: 2006-12-01
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Publication No.: US07659047B2Publication Date: 2010-02-09
- Inventor: Kyoko Kojima , Takashi Hattori
- Applicant: Kyoko Kojima , Takashi Hattori
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2005-348781 20051202
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; C07C39/04

Abstract:
With the tendency of reducing the size of semiconductor circuit patterns, edge roughness on a resist pattern is increased when pattern dimensions required are close to the size of the resist molecules. Provided is a technique for preventing degradation of the device performance and negative effects over the system performance caused by the phenomena. A photoresist compound is used, which is a molecule having functional groups that are chemically converted due to an action of an acid with reduced solubility in alkaline developer.
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