Invention Grant
- Patent Title: Pasting edge heater
- Patent Title (中): 贴边加热器
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Application No.: US10848593Application Date: 2004-05-17
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Publication No.: US07659109B2Publication Date: 2010-02-09
- Inventor: Hon Siu Shin , Hock Lai Khoo
- Applicant: Hon Siu Shin , Hock Lai Khoo
- Applicant Address: US CA Carlsbad
- Assignee: Applied Biosystems, LLC
- Current Assignee: Applied Biosystems, LLC
- Current Assignee Address: US CA Carlsbad
- Main IPC: C12M1/00
- IPC: C12M1/00 ; C12M1/34 ; C12M3/00 ; H01L35/28 ; H01L35/02 ; F27D11/00 ; B01L3/00 ; G05B15/00
Abstract:
An apparatus and method for thermal cycling including a pasting edge heater. The pasting edge heater can provide substantial temperature uniformity throughout the retaining elements during thermal cycling by a thermoelectric module.
Public/Granted literature
- US20050255586A1 Pasting edge heater Public/Granted day:2005-11-17
Information query
