Invention Grant
- Patent Title: Semiconductor element holding apparatus and semiconductor device manufactured using the same
- Patent Title (中): 半导体元件保持装置及使用其制造的半导体装置
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Application No.: US11717682Application Date: 2007-03-14
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Publication No.: US07659132B2Publication Date: 2010-02-09
- Inventor: Hiroyuki Tokudome
- Applicant: Hiroyuki Tokudome
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, P.C.
- Priority: JP2004-256391 20040903
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor element holding apparatus includes a collet for suctioning a semiconductor element by negative pressure to hold the semiconductor element. The collet has a protrusion formed at the semiconductor element-holding surface thereof, and the protrusion is provided with a plurality of suction holes. The suction holes are opened to the semiconductor element-holding surface. The surface of the semiconductor element is held by the semiconductor element-holding surface of the protrusion of the collet.
Public/Granted literature
- US20070205548A1 Semiconductor element holding apparatus and semiconductor device manufactured using the same Public/Granted day:2007-09-06
Information query
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