Invention Grant
- Patent Title: Integrated circuit system with a debris trapping system
- Patent Title (中): 具有碎片捕集系统的集成电路系统
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Application No.: US11694933Application Date: 2007-03-30
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Publication No.: US07659140B2Publication Date: 2010-02-09
- Inventor: Taewoo Lee , Sang-Ho Lee , BoHan Yoon
- Applicant: Taewoo Lee , Sang-Ho Lee , BoHan Yoon
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An integrated circuit system including: providing an integrated circuit wafer having an integrated circuit side and a backside; mounting a protective adhesive on the integrated circuit side of the integrated circuit wafer; removing material from the backside of the integrated circuit wafer; and dicing the integrated circuit wafer through the protective adhesive to form an integrated circuit die.
Public/Granted literature
- US20080242053A1 INTEGRATED CIRCUIT SYSTEM WITH A DEBRIS TRAPPING SYSTEM Public/Granted day:2008-10-02
Information query
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