Invention Grant
- Patent Title: Bonding method and apparatus
- Patent Title (中): 粘合方法和装置
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Application No.: US10599638Application Date: 2005-04-06
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Publication No.: US07659148B2Publication Date: 2010-02-09
- Inventor: Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
- Applicant: Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2004-113920 20040408
- International Application: PCT/JP2005/006740 WO 20050406
- International Announcement: WO2005/097396 WO 20051020
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/603 ; H05K3/32 ; H01L21/58
Abstract:
A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.
Public/Granted literature
- US20070193682A1 Bonding method and apparatus Public/Granted day:2007-08-23
Information query
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