Invention Grant
- Patent Title: Flip chip with interposer, and methods of making same
- Patent Title (中): 带插入器的倒装芯片及其制作方法
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Application No.: US11734497Application Date: 2007-04-12
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Publication No.: US07659151B2Publication Date: 2010-02-09
- Inventor: David J. Corisis , Tongbi Jiang
- Applicant: David J. Corisis , Tongbi Jiang
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/29
Abstract:
A device is disclosed which includes a die comprising an integrated circuit and an interposer that is coupled to the die, the interposer having a smaller footprint than that of the die. A method is disclosed which includes operatively coupling an interposer to a die comprising an integrated circuit, the interposer having a smaller footprint than that of the die, and filling a space between the interposer and the die with an underfill material.
Public/Granted literature
- US20080251943A1 FLIP CHIP WITH INTERPOSER, AND METHODS OF MAKING SAME Public/Granted day:2008-10-16
Information query
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