Invention Grant
- Patent Title: Method for forming silicon thin-film on flexible metal substrate
- Patent Title (中): 在柔性金属基板上形成硅薄膜的方法
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Application No.: US10570285Application Date: 2004-09-02
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Publication No.: US07659185B2Publication Date: 2010-02-09
- Inventor: Jin Jang , Jong-Hyun Choi , Seung-Soo Kim , Jae-Hwan Oh , Jun-Hyuk Chon
- Applicant: Jin Jang , Jong-Hyun Choi , Seung-Soo Kim , Jae-Hwan Oh , Jun-Hyuk Chon
- Applicant Address: KR Seoul
- Assignee: Kyunghee University Industrial & Academic Collaboration Foundation
- Current Assignee: Kyunghee University Industrial & Academic Collaboration Foundation
- Current Assignee Address: KR Seoul
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Priority: KR10-2003-0061230 20030902; KR10-2004-0056463 20040720
- International Application: PCT/KR2004/002213 WO 20040902
- International Announcement: WO2005/022619 WO 20050310
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
Disclosed are a method for forming a silicon thin-film on a substrate, and more particularly a method for forming a polycrystalline silicon thin-film of good quality on a flexible metal substrate. A metal substrate (110) is prepared and a surface of the metal substrate (110) is flattened. An insulation film (120) is formed on the metal substrate (110). An amorphous silicon layer (130) is formed on the insulation film (120). A metal layer (140) is formed on the amorphous silicon layer (130). A sample on the metal substrate (110) is heated and crystallized.
Public/Granted literature
- US20060286780A1 Method for forming silicon thin-film on flexible metal substrate Public/Granted day:2006-12-21
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