Invention Grant
- Patent Title: Low water-absorptive polyimide resin and method for producing same
- Patent Title (中): 低吸水性聚酰亚胺树脂及其制造方法
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Application No.: US11722190Application Date: 2005-12-19
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Publication No.: US07659360B2Publication Date: 2010-02-09
- Inventor: Takashi Makinoshima , Shuta Kihara
- Applicant: Takashi Makinoshima , Shuta Kihara
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2004-372949 20041224
- International Application: PCT/JP2005/023281 WO 20051219
- International Announcement: WO2006/068096 WO 20060629
- Main IPC: C08G69/08
- IPC: C08G69/08
Abstract:
A polyimide resin is produced by the reaction of a compound selected from 1,2,4,5-cyclohexanetetracarboxylic acid, dianhydride thereof and reactive derivatives thereof and a compound selected from diamines and diisocyanates each containing at least one phenylene group and at least one isopropylidene group. The polyimide resin is colorless and exhibits a high heat resistance, a high transparency and a low water absorption.
Public/Granted literature
- US20080132667A1 Low Water-Absorptive Polyimide Resin and Method for Producing Same Public/Granted day:2008-06-05
Information query
