Invention Grant
- Patent Title: Metal-binding motif compositions and methods
- Patent Title (中): 金属结合基序组合物和方法
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Application No.: US11420881Application Date: 2006-05-30
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Publication No.: US07659362B2Publication Date: 2010-02-09
- Inventor: Kuo-Chen Yeh , Cheng-Che Sage Kung
- Applicant: Kuo-Chen Yeh , Cheng-Che Sage Kung
- Applicant Address: TW Taipei
- Assignee: Academia Sinica
- Current Assignee: Academia Sinica
- Current Assignee Address: TW Taipei
- Agency: Occhiuti Rohlicek & Tsao LLP
- Main IPC: A61K38/00
- IPC: A61K38/00 ; C07K14/81
Abstract:
Disclosed herein are recombinant copper or zinc binding polypeptides containing at least one copper or zinc binding motif and a sequence heterologous to it. Also disclosed is a method to reduce the concentration of a free copper or zinc ion in a substrate by contacting it with a recombinant polypeptide containing a copper or zinc binding motif. A further method relates to reducing the concentration of a free copper or zinc ion in a substrate by contacting it with a host cell that expresses a recombinant polypeptide containing a copper or zinc binding motif.
Public/Granted literature
- US20070281333A1 METAL-BINDING MOTIF COMPOSITIONS AND METHODS Public/Granted day:2007-12-06
Information query
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