Invention Grant
- Patent Title: Systems for processing plate-like workpieces
- Patent Title (中): 板状工件加工系统
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Application No.: US11522062Application Date: 2006-09-15
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Publication No.: US07659490B2Publication Date: 2010-02-09
- Inventor: Hans-Jochen Beilke
- Applicant: Hans-Jochen Beilke
- Applicant Address: DE Ditzingen
- Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
- Current Assignee Address: DE Ditzingen
- Agency: Fish & Richardson P.C.
- Priority: EP04006283 20040317
- Main IPC: B23K26/14
- IPC: B23K26/14 ; B23K26/16

Abstract:
A system for processing plate-like workpieces, especially metal sheets, comprises a first processing device in the form of a cutting device and also a second processing device, on which a processing line is defined. By means of a workpiece bed of a longitudinal guide a workpiece is movable relative to the cutting device in a first axial direction extending in a longitudinal direction of the processing line into a processing position. The cutting device, together with a workpiece bed of a transverse guide in an inoperative state, is movable relative to a workpiece in a second axial direction extending in a direction transverse to the processing line and thus transferable into a processing position.
Public/Granted literature
- US20070051705A1 Systems for processing plate-like workpieces Public/Granted day:2007-03-08
Information query
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