Invention Grant
- Patent Title: Optical coupler package
- Patent Title (中): 光耦合器封装
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Application No.: US11735257Application Date: 2007-04-13
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Publication No.: US07659531B2Publication Date: 2010-02-09
- Inventor: Yoon Hwa Choi , Yong Suk Kwon , Maria Clemens Y. Quinones
- Applicant: Yoon Hwa Choi , Yong Suk Kwon , Maria Clemens Y. Quinones
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: G02B27/00
- IPC: G02B27/00
Abstract:
A method is disclosed. The method includes forming a substrate with a leadframe and a molding compound. The molding compound fills internal spaces in the leadframe and forms a dam structure. An optical emitter and an optical receiver are placed on the substrate. An optically transmissive medium is formed between the optical emitter and optical receiver.
Public/Granted literature
- US20080251739A1 OPTICAL COUPLER PACKAGE Public/Granted day:2008-10-16
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