Invention Grant
- Patent Title: Power surface mount light emitting die package
- Patent Title (中): 功率表面贴装发光管芯封装
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Application No.: US11694046Application Date: 2007-03-30
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Publication No.: US07659551B2Publication Date: 2010-02-09
- Inventor: Ban P. Loh
- Applicant: Ban P. Loh
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: F21V29/00
- IPC: F21V29/00 ; H01L33/00
Abstract:
A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to move relative to the substrate.
Public/Granted literature
- US20070181901A1 POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE Public/Granted day:2007-08-09
Information query
