Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11933897Application Date: 2007-11-01
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Publication No.: US07659576B2Publication Date: 2010-02-09
- Inventor: Kikuo Okada , Kojiro Kameyama
- Applicant: Kikuo Okada , Kojiro Kameyama
- Applicant Address: JP Moriguchi-shi JP Gunma
- Assignee: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- Current Assignee Address: JP Moriguchi-shi JP Gunma
- Agency: Morrison & Foerster LLP
- Priority: JP2006-298524 20061102
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A punch-through type IGBT generally has a thick p++-type collector layer. Therefore, the FWD need be externally attached to the IGBT when the IGBT is used as a switching element in an inverter circuit for driving a motor load, and thus the number of processes and components increases. In the invention, trenches are formed penetrating through a collector layer and reaching a buffer layer. A collector electrode is formed in the trenches, too. With this structure, a current path is formed between an emitter electrode and the collector electrode without through the collector layer and functions as the FWD.
Public/Granted literature
- US20080135870A1 Semiconductor Device and Method of Manufacturing the Same Public/Granted day:2008-06-12
Information query
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