Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11599322Application Date: 2006-11-15
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Publication No.: US07659580B2Publication Date: 2010-02-09
- Inventor: Hiromichi Godo , Hajime Tokunaga
- Applicant: Hiromichi Godo , Hajime Tokunaga
- Applicant Address: JP Atsugi-shi, Kanagawa-Ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-Ken
- Agency: Nixon Peabody, LLP
- Agent Jeffrey L. Costellia
- Priority: JP2005-349574 20051202
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L29/76

Abstract:
It is an object of the present invention to obtain a transistor with a high ON current including a silicide layer without increasing the number of steps. A semiconductor device comprising the transistor includes a first region in which a thickness is increased from an edge on a channel formation region side and a second region in which a thickness is more uniform than that of the first region. The first and second region are separated by a line which is perpendicular to a horizontal line and passes through a point where a line, which passes through the edge of the silicide layer and forms an angle θ (0°
Public/Granted literature
- US20070126058A1 Semiconductor device and manufacturing method thereof Public/Granted day:2007-06-07
Information query
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