Invention Grant
- Patent Title: Substrate for a flexible microelectronic assembly and a method of fabricating thereof
- Patent Title (中): 柔性微电子组件用基板及其制造方法
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Application No.: US11606771Application Date: 2006-11-30
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Publication No.: US07659617B2Publication Date: 2010-02-09
- Inventor: Teck-Gyu Kang , Jae M. Park , Yoichi Kubota
- Applicant: Teck-Gyu Kang , Jae M. Park , Yoichi Kubota
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Substrates having integrated rigid and flexible regions and methods of fabricating such substrates are disclosed. The substrates may advantageously be used for mounting semiconductor chips used in flexible microelectronic assemblies.
Public/Granted literature
- US20080128886A1 Substrate for a flexible microelectronic assembly and a method of fabricating thereof Public/Granted day:2008-06-05
Information query
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