Invention Grant
- Patent Title: Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
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Application No.: US10757388Application Date: 2004-01-15
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Publication No.: US07659634B2Publication Date: 2010-02-09
- Inventor: Takeshi Kobayashi , Hisao Sugoh
- Applicant: Takeshi Kobayashi , Hisao Sugoh
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-008349 20030116
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
There is provided a lead frame which comprises: a lead frame body comprising a sheet-shaped body made of metal; a groove portion for forming a lead which is formed by a predetermined depth in a lead forming region on a surface of the lead frame body; and a lead portion formed so that the lead portion can protrude from the groove portion onto the surface of the lead frame body, the lead portion being made of material different from material of the lead frame body. A thin type semiconductor device is provided in which the above lead frame is used and after a chip is mounted, the lead frame body is removed by means of etching.
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