Invention Grant
US07659738B2 Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same
有权
具有珀耳帖元件的测试插座，包括相同的测试设备以及使用其测试半导体封装的方法
- Patent Title: Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same
- Patent Title (中): 具有珀耳帖元件的测试插座，包括相同的测试设备以及使用其测试半导体封装的方法
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Application No.: US12017202Application Date: 2008-01-21
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Publication No.: US07659738B2Publication Date: 2010-02-09
- Inventor: Jun-Pyo Hong
- Applicant: Jun-Pyo Hong
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2007-0006644 20070122
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A test socket includes a socket body in which a semiconductor package is located, a socket head combined with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element. A test equipment includes the test socket and a method of testing the semiconductor package uses the test socket.
Public/Granted literature
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