Invention Grant
- Patent Title: Thermostat
- Patent Title (中): 恒温器
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Application No.: US11667102Application Date: 2006-01-26
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Publication No.: US07659805B2Publication Date: 2010-02-09
- Inventor: Hideaki Takeda
- Applicant: Hideaki Takeda
- Applicant Address: JP
- Assignee: Uchiya Thermostat Co., Ltd.
- Current Assignee: Uchiya Thermostat Co., Ltd.
- Current Assignee Address: JP
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Priority: JP2005-027101 20050202
- International Application: PCT/JP2006/301252 WO 20060126
- International Announcement: WO2006/082749 WO 20060810
- Main IPC: H01H37/12
- IPC: H01H37/12 ; H01H37/54 ; H01H37/52 ; H01H37/00

Abstract:
A thermostat has a movable place where a spring point and a securing plate portion are integrally formed. The spring point is provided with a movable contact at a position that faces a fixed contact, a protrusion with which a bimetal that counter turns comes into contact, a hole for inserting the head of a bimetal holding point, and a protrusion for holding the bimetal, and the spring point is valley-folded at a folding point so as to face the securing plate portion. The securing plate portion is integrally constituted of a terminal point connected to one external terminal, a fixation point for securing an insulating plate, which has the fixed contact in a manner to hold the plate from both sides, and a holding point folded and set up, penetrating a central hole of the bimetal to hold the bimetal.
Public/Granted literature
- US20070296540A1 Thermostat Public/Granted day:2007-12-27
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