Invention Grant
- Patent Title: Chip resistor and method of making the same
- Patent Title (中): 芯片电阻及其制作方法
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Application No.: US12074254Application Date: 2008-02-29
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Publication No.: US07659806B2Publication Date: 2010-02-09
- Inventor: Yoshikazu Tamaki
- Applicant: Yoshikazu Tamaki
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2007-052491 20070302
- Main IPC: H01C1/012
- IPC: H01C1/012
Abstract:
A chip resistor includes an insulating substrate, a pair of electrodes formed on a main surface of the substrate and a resistor element electrically connected to the electrodes. The paired electrodes are spaced from each other in a first direction. The main surface of the substrate is formed with a raised portion in the form of a plateau which is smaller in size than the substrate in a second direction perpendicular to the first direction. The paired electrodes are formed on the raised portion. The resistor element is equal in size to the raised portion in the second direction.
Public/Granted literature
- US20080218306A1 Chip resistor and method of making the same Public/Granted day:2008-09-11
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