Invention Grant
- Patent Title: Apparatus for crystallizing semiconductor with laser beams
- Patent Title (中): 用激光束使半导体结晶的装置
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Application No.: US11148050Application Date: 2005-06-08
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Publication No.: US07660042B2Publication Date: 2010-02-09
- Inventor: Nobuo Sasaki , Koichi Ohki
- Applicant: Nobuo Sasaki , Koichi Ohki
- Applicant Address: JP Osaka JP Tokyo
- Assignee: Sharp Kabushiki Kaisha,Japan Laser Corporation
- Current Assignee: Sharp Kabushiki Kaisha,Japan Laser Corporation
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2002-143032 20020517; JP2002-143070 20020517; JP2002-143097 20020517
- Main IPC: H01L31/0232
- IPC: H01L31/0232

Abstract:
Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles between the laser beams is corrected by a beam expander. The apparatus includes a sub-beam selective irradiating system including a sub-beam dividing assembly and a sub-beam focussing assembly. Also, the apparatus includes laser sources, a focussing optical system, and a combining optical system. A stage for supporting a substrate includes a plurality of first stage members, a second stage member disposed above the first stage members, and a third stage member 38C, rotatably disposed above the second stage to support an amorphous semiconductor.
Public/Granted literature
- US20050225771A1 Method and apparatus for crystallizing semiconductor with laser beams Public/Granted day:2005-10-13
Information query
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