An apparatus for positioning an electronics module in an equipment chassis with adequate pathways for the flow of cooling air across the module or across one or more adjacent modules, such as one or more blade server. The system includes an electronics module movably secured within a sub-assembly prior to installing the sub-assembly in a bay of a chassis. Ramps disposed within one or more bays of the chassis engage and position the electronics modules within the range of movement permitted by the sub-assembly when the sub-assembly has been installed in the chassis. Two bays having ramps positioned differently can receive the same sub-assembly or an identical sub-assembly and position the module differently. Therefore, the sub-assemblies are interchangeable while maintaining appropriate air flow pathways.