Invention Grant
US07660111B2 Removable cooling duct with interlocking dovetail connections for an air tight thermal seal
有权
可拆卸冷却管道，具有互锁的燕尾连接，用于气密热封
- Patent Title: Removable cooling duct with interlocking dovetail connections for an air tight thermal seal
- Patent Title (中): 可拆卸冷却管道，具有互锁的燕尾连接，用于气密热封
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Application No.: US11947299Application Date: 2007-11-29
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Publication No.: US07660111B2Publication Date: 2010-02-09
- Inventor: Dennis R. Barringer , Robert R. Genest , John J. Loparco , Wade H. White
- Applicant: Dennis R. Barringer , Robert R. Genest , John J. Loparco , Wade H. White
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Geraldine D. Monteleone; Lily Neff
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00
Abstract:
A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.
Public/Granted literature
- US20090141442A1 Removable Cooling Duct With Interlocking Dovetail Connections For An Air Tight Thermal Seal Public/Granted day:2009-06-04
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