Invention Grant
- Patent Title: Heat dissipating member, heat dissipating mechanism, and information processing apparatus
- Patent Title (中): 散热构件,散热机构和信息处理装置
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Application No.: US12108103Application Date: 2008-04-23
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Publication No.: US07660114B2Publication Date: 2010-02-09
- Inventor: Hayato Watanabe , Satoshi Odanaka
- Applicant: Hayato Watanabe , Satoshi Odanaka
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-128796 20070515
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34

Abstract:
A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an inner space of the apparatus to the outside regardless of the layout position of the unit by using the heat dissipating mechanism fixed to a unit and a heat dissipation surface so that the heat is transferred from the unit to the heat dissipation surface.
Public/Granted literature
- US20080285229A1 HEAT DISSIPATING MEMBER, HEAT DISSIPATING MECHANISM, AND INFORMATION PROCESSING APPARATUS Public/Granted day:2008-11-20
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