Invention Grant
US07660129B2 Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board
失效
印刷电路板，印刷电路板和柔性印刷电路板之间的焊接连接结构和方法
- Patent Title: Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board
- Patent Title (中): 印刷电路板，印刷电路板和柔性印刷电路板之间的焊接连接结构和方法
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Application No.: US12022540Application Date: 2008-01-30
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Publication No.: US07660129B2Publication Date: 2010-02-09
- Inventor: Yuuji Minota , Yasuhiro Fukutomi , Motonobu Koike
- Applicant: Yuuji Minota , Yasuhiro Fukutomi , Motonobu Koike
- Priority: JP2007-038501 20070219
- Main IPC: H05K7/10
- IPC: H05K7/10
Abstract:
There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit board 1 includes a plurality of pads 2 for mounting a flexible printed circuit board, wherein a solder resist 3 is formed on the surface of the printed circuit board so as to expose the pads 2 and convex portions are formed by insulation print layers 4 around the pads 2.
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