Invention Grant
- Patent Title: Multi-dwelling unit module for passive optical networks
- Patent Title (中): 无源光网络多住户单元模块
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Application No.: US11026123Application Date: 2004-12-30
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Publication No.: US07660409B1Publication Date: 2010-02-09
- Inventor: Richard Marion Czerwiec , Manal Afify , Atahan Tuzel , Barry Lee Moffitt , Joseph Lee Smith , Anthony Peter Noto , David Charles Fargo , Bobby Lane English , John David Boyle , Alain Granger , Jak Yaemsiri , Andreas Flach , John Scott Cao , Ali Rezaki , Charles Pearse , Bakri Aboukarr , Arkin Aydin , Angelo Arlotta , Nicholas Adam Bundza
- Applicant: Richard Marion Czerwiec , Manal Afify , Atahan Tuzel , Barry Lee Moffitt , Joseph Lee Smith , Anthony Peter Noto , David Charles Fargo , Bobby Lane English , John David Boyle , Alain Granger , Jak Yaemsiri , Andreas Flach , John Scott Cao , Ali Rezaki , Charles Pearse , Bakri Aboukarr , Arkin Aydin , Angelo Arlotta , Nicholas Adam Bundza
- Applicant Address: FR Paris
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Paris
- Agency: Galasso & Associates LP
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04M9/00

Abstract:
A multi-dwelling unit (MDU) module is configured for providing telephony communicating services and non-telephony services. The MDU module includes a motherboard and a plurality of service units connected to the motherboard. Each one of said service units and the motherboard are jointly configured for providing non-telephony service and telephony service to a plurality of service subscribers. The motherboard is configured for providing overload power management to limit power consumption associated with said telephony services during an overload condition and for providing lifeline power management to limit power consumption associated with said non-telephony services during a power outage condition. The MDU module optionally includes lightning primary surge protection blocks configured for being connected to the service units. The MDU module includes a passive heat dissipation assembly that is configured for absorbing heat generated by the motherboard and the service units and for passively dissipating the heat.
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