Invention Grant
- Patent Title: Using statistical signatures for testing high-speed circuits
- Patent Title (中): 使用统计特征来测试高速电路
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Application No.: US12021950Application Date: 2008-01-29
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Publication No.: US07661052B2Publication Date: 2010-02-09
- Inventor: Hayden C. Cranford, Jr. , Vernon R. Norman , Martin L. Schmatz
- Applicant: Hayden C. Cranford, Jr. , Vernon R. Norman , Martin L. Schmatz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Agent Mark E. McBurney
- Main IPC: G06F11/277
- IPC: G06F11/277 ; G06F11/16

Abstract:
A method and system for testing a high-speed circuit is disclosed. The method and system include obtaining a high-speed statistical signature of the high-speed circuit using a conventional tester. The method and system further include comparing the high-speed statistical signature of the high-speed circuit to an expected signature. Consequently, it can be determined whether the high-speed circuit functions within the desired parameters.
Public/Granted literature
- US20080133164A1 USING STATISTICAL SIGNATURES FOR TESTING HIGH-SPEED CIRCUITS Public/Granted day:2008-06-05
Information query
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