Invention Grant
- Patent Title: Method and system for implementing metal fill
- Patent Title (中): 实施金属填充的方法和系统
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Application No.: US11069759Application Date: 2005-02-28
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Publication No.: US07661078B1Publication Date: 2010-02-09
- Inventor: David C. Noice , William Kao , Inhwan Seo , Xiaopeng Dong , Gary W. Nunn
- Applicant: David C. Noice , William Kao , Inhwan Seo , Xiaopeng Dong , Gary W. Nunn
- Applicant Address: US CA San Jose
- Assignee: Cadence Design Systems, Inc.
- Current Assignee: Cadence Design Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Vista IP Law Group, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F9/45

Abstract:
Disclosed is an improved method and system for implementing metal fill for an integrated circuit design. When an engineering change order is implemented, the existing dummy metal fill geometries are initially ignored when modifying the layout, even if this results in shorts and/or other DRC violations. Once the ECO changes have been implemented, those violations caused by interaction between the changes and the metal fill are repaired afterwards.
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