Invention Grant
- Patent Title: Underpressure surface gripping device
- Patent Title (中): 低压表面夹紧装置
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Application No.: US11717653Application Date: 2007-03-14
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Publication No.: US07661736B2Publication Date: 2010-02-16
- Inventor: Kurt Schmalz , Thomas Eisele , Leonhard Harter
- Applicant: Kurt Schmalz , Thomas Eisele , Leonhard Harter
- Applicant Address: DE Glatten
- Assignee: J. Schmalz GmbH
- Current Assignee: J. Schmalz GmbH
- Current Assignee Address: DE Glatten
- Agent Paul Vincent
- Priority: DE102006013970 20060315
- Main IPC: B25J15/06
- IPC: B25J15/06

Abstract:
The invention concerns an underpressure surface gripping device with an extruded profile having a hollow chamber, a vacuum plate which is mounted parallel to the extruded profile, at least one flow through opening which connects the extruded profile to the vacuum plate, and with an ejector as a vacuum generator, wherein the ejector is inserted into the hollow chamber of the extruded profile and the suction opening of the ejector communicates with the flow through opening.
Public/Granted literature
- US20080129062A1 Underpressure surface gripping device Public/Granted day:2008-06-05
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